Case Study

MRI 零间隙 Balun 组件 PEI 成型

We engineered a highly resilient split-shell PEI design with robust copper adhesion. This flawless structural integrity eliminates common-mode currents in continuous scanning environments.

Industry: Leading Tier-1 Medical Imaging OEM
Material: Unfilled Polyetherimide (PEI)
Volume: 15,000+ units/year
Lead Time: 8 weeks from DFM to PPAP

Overcoming RF Leakage: Engineering Zero-Gap Balun Assemblies for MRI Diagnostics

We engineered a highly resilient split-shell PEI design with robust copper adhesion. This flawless structural integrity eliminates common-mode currents in continuous scanning environments.

Outcome Metrics

Material: Unfilled PEI (UL94 V-0)
Dielectric: Stable Dk / low Df
Plating: High-conductivity Copper
Bond: Permanent copper-to-plastic
RF: Zero-gap split-shell shield
Validated under thermal cycling

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